Paper shows glass-embedded silicon trench capacitors enabling 50µm-thick vertical power delivery
jwt0625 · x · 2026-10-20
A tweet highlighting the paper "Embedded Silicon Chip Capacitors in Glass Package for Vertical Power Delivery," which embeds deep-trench silicon capacitors (DTCs) inside a glass package just 50–210µm thick to deliver power vertically to the processor.
- Multi-terminal chip design with four source pad groups (CapA–CapD) plus ground pads in an ultra-high-density layout
- Combined with embedded inductors and flip-chip GaN devices in integrated voltage regulator (IVR) modules, placing capacitance directly beneath the processor to shorten the power loop
- Author marvels at how tiny the physical parts are, with a ruler comparison photo
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