Diamond-embedded copper vias shown to boost chip thermal conductivity
jwt0625 · x · 2026-10-20
X user jwt0625 shared microscopy/EDX images of a packaging scheme that embeds diamond particles inside copper vias to improve thermal conductivity, with element maps clearly showing Cu, Si, and C distributions between two silicon dies.
The author uses it to argue for a broader return of carbon to chipmaking: graphene transistors and diamond dielectrics/interposers/substrates. Diamond's thermal conductivity far exceeds that of silicon and copper, making this a notable advanced-packaging cooling direction.
Related event: Diamond-Embedded Copper Vias Boost Advanced Packaging Thermal Performance(2 posts)→
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