A forgotten supercomputer design: bare dies, gold post interconnects, 3D stacking, immersion cooling
jwt0625 · x · 2026-10-28
A look at a vintage supercomputer design that used bare dies instead of packaged chips, with gold post interconnects handling both mechanical and electrical connections, laser-welded vertical jumpers for 3D stacking, liquid immersion cooling, and tens of miles of internal wiring. The shared photos show a handheld multi-chip module, the layered stacking architecture, and cable-dense immersion cooling tanks — a rare visual record of early HPC engineering.
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