Helion signs LOI for $175M CHIPS award to build pulsed power semiconductors in the US
ycombinator · x · 2026-10-24
Fusion company Helion Energy has signed a letter of intent with the U.S. Commerce Department for a $175 million CHIPS award to develop next-generation pulsed power semiconductors domestically — faster, cooler, and smaller than overseas alternatives — supporting its fusion energy roadmap.
More from Infra
- Google Cloud launches CLI Remote MCP Server for agents to run gcloud & bq without local installs — rseroter · 2026-10-24
- Baseten launches Environment Network, pairing vetted RL environment firms with post-training customers — baseten · 2026-10-24
- Bittensor-powered Engy hits 103B daily tokens, undercutting official API prices by up to 90% — markjeffrey · 2026-10-24
- DeepSeek serves 150T tokens/day on one cluster, more than OpenRouter, Fireworks, Together and BaseTen combined — natolambert · 2026-10-24
- Gradium open-sources Phonon: 31M-param on-device TTS with 0.02s latency, Apache 2.0 — natesiggard · 2026-10-24
- Meta and NVIDIA on Prometheus: gigawatt training cluster cut failures by 99% — BenBajarin · 2026-10-24