Korean media corroborates Groq's plan to stack DRAM in next-gen chips via 3DS
rohanpaul_ai · x · 2026-10-21
ZDNet Korea corroborates earlier reports: Groq, effectively acquired by Nvidia, is pursuing 3D packaging in its next chip, swapping SRAM for DRAM to massively raise capacity.
- The reported design, 3DS (3D Stacked Memory), connects DRAM dies vertically via TSV—similar to HBM but focused on capacity with a standard DRAM interface, unlike HBM's speed-first design
- Industry read: SRAM is fast but small, DRAM slower but capacity-friendly, and the market wants bigger chips
- Groq was founded in 2016 by ex-Google TPU designer Jonathan Ross and was indirectly acquired by Nvidia last year
(Same event as the detailed Groq DRAM-stacking analysis post.)
Related event: Groq to Adopt 3D-Stacked DRAM in Next-Gen LPU to Break SRAM Capacity Limit(3 posts)→
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