Groq to Adopt 3D-Stacked DRAM in Next-Gen LPU to Break SRAM Capacity Limit

Groq, effectively acquired by NVIDIA for about $20 billion, plans to use 3D-stacked DRAM via TSV packaging in its next-generation inference chips, replacing its SRAM-centric design to overcome capacity limits.

2026-10-21 ~ 2026-10-21 · 3 related posts

• Nvidia-owned Groq plans 3D-stacked DRAM for next-gen chips to break SRAM capacity limits — jukan05 · 2026-10-21

2 near-duplicate retellings: rohanpaul_ai · rohanpaul_ai