Nvidia-owned Groq plans 3D-stacked DRAM for next-gen chips to break SRAM capacity limits
jukan05 · x · 2026-10-21
According to ZDNet Korea, Groq — effectively acquired by Nvidia — is moving to adopt 3DS (3D Stacked Memory) packaging in its next-generation LPU chips, stacking DRAM vertically via TSV instead of its SRAM-centric design. SRAM is fast but small; DRAM is slower but scales capacity. Like HBM, 3DS uses TSV, but rather than optimizing transfer speed it keeps the standard DRAM interface and focuses on capacity. Industry sources read the move as a bid to sharply increase chip capacity amid market demand for larger chips. Groq was founded in 2016 by ex-Google TPU designer Jonathan Ross.
Related event: Groq to Adopt 3D-Stacked DRAM in Next-Gen LPU to Break SRAM Capacity Limit(3 posts)→
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