Huawei details Kirin chips for the first time in six years: 1.5μm hybrid bonding roadmap
智东西 · wechat · 2026-10-15
At a two-day technical briefing in Shanghai, Huawei for the first time in six years detailed its Kirin chip technology, covering hybrid bonding at 1.5μm spacing with over 50 million bonds, plus a 'Kirin 2027' roadmap. Device CTO Li Xiaolong also broke down the Z10 camera module (300+ components, 76 patents), the scratch-resistant low-reflection Xuanwu Kunlun glass, and an on-device 30B model enabled by multi-level compute-storage coordination. Huawei's H1 R&D spending hit 121.4 billion yuan, up 22%.
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