Intel engineers show wafer-level chiplet testing for co-packaged optics paper
jwt0625 · x · 2026-09-12
jwt0625 highlights a 2026 paper, "V-groove Based Edge Coupling Enabled by Optical Glass Coupler Attach for Co-packaged Optics," which proposes attaching an optical glass coupler to enable V-groove edge coupling for fiber-to-chip alignment in co-packaged optics (CPO).
The author also calls out visible JMP (joint issues) and mechanical epoxy (ME) delamination in the work. Accompanying footage shows Intel personnel testing chiplets and packages on a wafer-level tester, offering a rare look at real CPO packaging engineering.
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