CPO paper criticized for vague DLW-to-PIC coupling description: 'such as TCB'
jwt0625 · x · 2026-09-12
jwt0625 points out a gap in a 2026 paper on detachable edge-coupling connectors for CPO using a glass coupler and expanded beam: the paper only vaguely describes how the DLW chip is coupled to the PIC, citing 'high precision assembly process such as thermal compression bonding (TCB)' — and questions what 'such as' even means.
Related event: CPO Edge-Coupled Connector Paper Questioned Over Missing Coupling Details(2 posts)→
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