SK Hynix advances 3D packaging; Xiaomi unveils Xuanjie O3/O100/D100 chips
创业邦 · wechat · 2026-08-25
SK Hynix plans to introduce advanced packaging technologies like Intel's EMIB for next-gen HBM and is exploring hybrid bonding to break the 16-layer stacking limit, aiming to solve power challenges via increased TSVs and optimized IO speeds/PDN. Xiaomi unveiled three chips: the 3nm mobile SoC Xuanjie O3 (mass production started), the LLM accelerator O100 (supporting 330Tokens/s inference), and the smart driving chip D100, with the latter two launching commercially next year.
Related event: Xiaomi Unveils Xring O100 Edge AI Chip, Commercial in 2027(3 posts)→
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