Xiaomi Unveils Xring O100 Edge AI Chip; SK Hynix Pushes 3D Packaging

Xiaomi launched its Xring O100 edge AI accelerator with 3D-stacked 6nm NPU and dual DRAM wafers using hybrid bonding, while SK Hynix plans to adopt Intel EMIB and hybrid bonding for next-gen HBM to overcome 16-layer stacking limits.

2026-08-24 ~ 2026-08-25 · 2 related posts