AI Needs Mo Memory; SK Hynix Explores Hybrid Bonding and I-HBM
firstadopter · x · 2026-08-24
At the Hot Chips conference, addressing AI's immense demand for memory, SK Hynix showcased progress in hybrid bonding and I-HBM technologies. While SRAM is fast, it is limited in capacity; new memory technologies aim to solve this bottleneck.
Related event: Hot Chips Spotlights AI Memory Bottleneck: 3D DRAM and zHBM Converge(11 posts)→
More from Infra
- NVIDIA releases Nemotron 3.5 Bolt 74B MoE that fits in 24GB VRAM at 2-bit — NerdyRodent · 2026-10-16
- Analyst: 80% of neoclouds may not survive, but the demand for their GPU capacity is real — BenBajarin · 2026-10-16
- Apple and Meta partner to run Muse Spark model on linked Mac Studios — pdamodaran · 2026-10-16
- Nvidia's developer base hits 11 million, up ~3.7x from 3 million in 2021 — Beth_Kindig · 2026-10-16
- Muse Spark Open runs locally on a Mac M3 Ultra via llama.cpp: frontier model on desktop — pcuenq · 2026-10-16
- Muse-Spark open-weights drop: 816B-A42B MoE model gets 359GB MLX 3-bit build — ns123abc · 2026-10-16