3D-DRAM and zHBM architecture insights from HotChips 2026
bookwormengr · x · 2026-08-24
Discussions from HotChips 2026 highlight 3D-DRAM: placing DRAM below (or above) the logic die offers higher bandwidth compared to 2.5D-packaged HBM, albeit with less capacity. zHBM is noted as the third phase of HBM evolution, where c-dies are placed directly on top of XPU (GPU/ASIC) dies, a concept similar to Huawei's Tau Scaling approach.
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