3D-DRAM and zHBM architecture insights from HotChips 2026
bookwormengr · x · 2026-08-24
Discussions from HotChips 2026 highlight 3D-DRAM: placing DRAM below (or above) the logic die offers higher bandwidth compared to 2.5D-packaged HBM, albeit with less capacity. zHBM is noted as the third phase of HBM evolution, where c-dies are placed directly on top of XPU (GPU/ASIC) dies, a concept similar to Huawei's Tau Scaling approach.
Related event: Hot Chips Spotlights AI Memory Bottleneck: 3D DRAM and zHBM Converge(11 posts)→
More from Infra
- Apple and Meta partner to run Muse Spark model on linked Mac Studios — pdamodaran · 2026-10-16
- Nvidia's developer base hits 11 million, up ~3.7x from 3 million in 2021 — Beth_Kindig · 2026-10-16
- Muse Spark Open runs locally on a Mac M3 Ultra via llama.cpp: frontier model on desktop — pcuenq · 2026-10-16
- Muse-Spark open-weights drop: 816B-A42B MoE model gets 359GB MLX 3-bit build — ns123abc · 2026-10-16
- Meta launches Muse Spark Open, says it runs on two M5 Ultra Mac Studios with Apple's help — The Verge AI · 2026-10-16
- vLLM ships Day-0 LoRA RL for Muse Spark Open, lifting AIME from 0.56 to 0.85 — vllm_project · 2026-10-16