Hot Chips: SK Hynix and Samsung Bet on Next-Gen HBM for AI

At Hot Chips, SK Hynix stressed HBM's dominance in AI compute while Samsung unveiled a zHBM roadmap claiming 70% lower power; SK Hynix also showed hybrid bonding and I-HBM to address AI's memory bottleneck.

2026-08-24 ~ 2026-08-24 · 2 related posts

• SK Hynix Hypes HBM Dominance; Samsung zHBM Aims for 70% Power Cut — firstadopter · 2026-08-24
• AI Needs Mo Memory; SK Hynix Explores Hybrid Bonding and I-HBM — firstadopter · 2026-08-24