SK Hynix prepares to break ground on $3.87B Indiana HBM packaging fab
rwang07 · x · 2026-08-04
- SK Hynix is preparing to break ground on its Indiana semiconductor fab as early as the end of this month, with U.S. hiring already underway.
- The $3.87 billion project in West Lafayette is aimed at HBM packaging, testing, certification, R&D, and next-generation product testbeds, so chips can be shipped closer to major U.S. customers.
- The site is expected to start operating in the second half of 2028, likely producing higher-generation HBM such as HBM4E and HBM5.
- The U.S. government previously pledged a $450 million direct subsidy and a $500 million loan for the investment.
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