Samsung's Xi'an Plant Shifts to 286-Layer V9 NAND, Targeting 40K Wafers Monthly by 2027

Samsung is upgrading its Xi'an plant, which accounts for about 40% of its global NAND output, to 286-layer V9 chips under the 'Monami' project, targeting 5,000 wafers per month by December and 40,000 by 2027, while SK Hynix plans to upgrade its Dalian plant to 240 layers.

2026-10-22 ~ 2026-10-22 · 2 related posts

• Samsung upgrades Xian plant to 286-layer NAND, SK Hynix seeks 240 layers in Dalian — rohanpaul_ai · 2026-10-22

1 near-duplicate retellings: rohanpaul_ai