Samsung converts Xi'an NAND plant to 286-layer V9 chips, targeting 40K wafers/month by 2027
rohanpaul_ai · x · 2026-10-22
Samsung is converting its Xi'an plant, which produces about 40% of its global NAND output, from 200-layer chips to 286-layer V9 chips under an internal project called "Monami", targeting 5,000 wafers/month in December and 40,000 wafers/month by December 2027. SK Hynix meanwhile plans to lift its Dalian plant from 192-layer NAND to 240 layers or more, with reports the upgrade is already underway.
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