GlobalFoundries Signs $2B Deal with TSMC to Expand CoWoS Interposer Production

GlobalFoundries and TSMC signed a five-year, $2B agreement to expand silicon interposer production in New York for TSMC's CoWoS advanced packaging, as AI chip demand drives a shortage of the critical component.

2026-10-13 ~ 2026-10-14 · 2 related posts

• AI's silicon interposer crunch: GlobalFoundries lands $2B TSMC deal as old fabs hike prices — demian_ai · 2026-10-13
• GlobalFoundries and TSMC sign $2B five-year deal to make CoWoS interposers in New York — Beth_Kindig · 2026-10-14