GlobalFoundries and TSMC sign $2B five-year deal to make CoWoS interposers in New York
Beth_Kindig · x · 2026-10-14
GlobalFoundries ($GFS) has partnered with TSMC ($TSM) in a $2 billion, five-year deal to expand fab capacity in New York for producing silicon interposers used in TSMC's CoWoS advanced packaging.
Production is expected to start ramping in early 2028, benefiting AI chip customers including NVIDIA, AMD and Broadcom. Advanced packaging capacity remains a key bottleneck in the AI compute supply chain, and this deal should help ease it.
More from Infra
- Cooler Master launches 300 kW liquid cooling CDU, up to 450 kW, for GB200/GB300 racks — BenBajarin · 2026-10-14
- MSAR brings multi-head depth attention to residuals, beating AttnRes and mHC with 1.58x iso-loss speedup — SonglinYang4 · 2026-10-14
- Cloudflare's pipeline handles 2B events/sec, five years of optimization deferred 2.5 years of hardware growth — irvinebroque · 2026-10-14
- South Korea to deploy 74 portable Starlink systems for forestry by end of 2026 — XFreeze · 2026-10-14
- ThunderSyncRL speeds agentic RL up to 1.9x with zero policy staleness, Stanford paper claims — heghbalz · 2026-10-14
- Agent task costs fall ~90% every 6 months, countering Bloomberg's data center cost alarm — sudoraohacker · 2026-10-14