AI's silicon interposer crunch: GlobalFoundries lands $2B TSMC deal as old fabs hike prices
demian_ai · x · 2026-10-13
Three signals show the humble silicon interposer — the CoWoS bottleneck — is squeezing legacy fab capacity: GlobalFoundries signed a 5-year, $2B deal to make interposers for TSMC in New York (ramping H1 2028); Vanguard/NXP's Singapore fab cut planned output by 1/5 to make room; Taiwan OSATs are raising prices 10–30%. The author argues interposers, power chips and packaging bidding for the same legacy capacity — and the resulting price hikes — aren't priced in yet, noting some power chips are already up 25%.
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