GlobalFoundries Signs $2 Billion Deal with TSMC for US-Made Interposers

GlobalFoundries has signed a five-year, $2 billion agreement with TSMC to produce silicon interposers at its Malta, New York fab for TSMC's CoWoS advanced packaging ecosystem, creating the first US-based source of silicon interposers for AI chips.

2026-10-08 ~ 2026-10-09 · 2 related posts

• GlobalFoundries signs $2B deal to supply TSMC's CoWoS advanced packaging from US soil — pstAsiatech · 2026-10-08
• GlobalFoundries Signs 5-Year TSMC Deal to Make AI Chip Interposers in New York — teortaxesTex · 2026-10-09