GlobalFoundries signs $2B deal to supply TSMC's CoWoS advanced packaging from US soil
pstAsiatech · x · 2026-10-08
GlobalFoundries announced a multi-year $2 billion agreement with TSMC to establish the first US-based supply of silicon interposers for TSMC's CoWoS advanced packaging ecosystem, including embedded deep trench capacitor components. GF will expand capacity at its Malta, New York facility, with volume production ramping in H1 2028, targeting surging AI and HPC packaging demand.
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