GlobalFoundries Signs 5-Year TSMC Deal to Make AI Chip Interposers in New York
teortaxesTex · x · 2026-10-09
GlobalFoundries signed a 5-year agreement with TSMC to produce silicon interposers for TSMC's CoWoS advanced packaging ecosystem at its Malta, New York fab, aiming to create the first US-based silicon interposer supply source. Production ramps in H1 2028, alongside advanced deep trench capacitors.
Related event: GlobalFoundries Signs $2 Billion Deal with TSMC for US-Made Interposers(2 posts)→
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