Thermocompression Bonding Parameters for 200mm Wafers Spark Discussion

Tech community members shared thermocompression bonding parameters for 200mm wafers: 70 kN of pressure at 400-450°C for 20-45 minutes in aluminum processes, sparking discussion about the bonding technique.

2026-09-27 ~ 2026-09-27 · 2 related posts

• TIL thermocompression bonding: 70 kN on a 200mm wafer at 400-450°C — F4DAV · 2026-09-27
• Thermocompression bonding a 200mm wafer: 70 kN at 400-450°C for 20-45 min — jwt0625 · 2026-09-27