Huawei Unveils Ascend 960 and UnifiedBus for Million-Chip Clusters

At its 2026 Connect event, Huawei unveiled the Ascend 960DT (pulled forward to Q1 2027, 2 PFLOPS FP8) and 960PR, featuring LogicFolding architecture and a new UnifiedBus interconnect targeting million-processor clusters, widely seen as a bellwether for China's AI compute supply chain.

2026-09-17 ~ 2026-09-17 · 4 related posts

Full story(2 episodes)→

• Episode 1: Huawei's Ascend 960DT rumored to offer 288GB memory in 2027(2026-09-17, 3 posts)
• Episode 2: Huawei Unveils Ascend 960 and UnifiedBus for Million-Chip Clusters(2026-09-17, 4 posts)

• Huawei Unveils Ascend 960 Chips and SuperPoD Stack Aiming at Million-Card Clusters — 智东西 · 2026-09-17
• Huawei pulls Ascend 960DT forward to Q1 2027 with 2x compute, but smaller SuperPoD — GlennLuk · 2026-09-17
• Huawei unveils Ascend 960 chips for 2027 and UnifiedBus linking one million processors — mark_k · 2026-09-17
• Huawei's Ascend 960 to debut LogicFolding architecture amid memory reallocation clues — GlennLuk · 2026-09-17