Xiaomi Unveils Xring O100 Edge AI Accelerator with 3D Stacking Tech
zephyr_z9 · x · 2026-08-24
Xiaomi unveiled the Xring O100, its first dedicated high-bandwidth AI accelerator for edge large models. It features vertical Wafer-on-Wafer 3D stacking of a 6nm NPU compute wafer and dual high-speed DRAM memory wafers. Using advanced Hybrid Bonding, the bonding pitch shrinks from 50 μm to 1.4 μm, creating 2.58 million high-speed physical pathways.
Related event: Xiaomi Unveils Xring O100 Edge AI Chip, Commercial in 2027(3 posts)→
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