Liquid Cooling to Hit 59% of AI Chips by 2027, a 10x Jump in Four Years
Beth_Kindig · x · 2026-11-08
Analyst Beth Kindig argues liquid cooling is now a necessity for maximizing data center density within fixed power envelopes as Blackwell Ultra ramps and Rubin and AMD Helios approach, with adoption accelerating sharply in 2026-2027.
Citing TrendForce data, liquid cooling penetration among AI chips grows from 6% in 2023 and 33% in 2025 to a forecast 53% in 2026 and 59% in 2027 — roughly 10x in four years.
The broader thesis: enterprises and neoclouds are driving a second wave of AI infrastructure spending. Nvidia's ACIE segment hit $40.3B revenue growing 138.5%, outpacing hyperscalers' 101.2%, and Dell forecasts half of 200GW of new AI data center capacity through 2030 will come from these customers — a $1 trillion opportunity over four years.
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