Samsung chairman visits Yokohama advanced packaging lab, pledging ¥40B investment over five years
pstAsiatech · x · 2026-11-02
Samsung Electronics Executive Chairman Lee Jae-yong visited the Advanced Package Lab in Yokohama, Japan, pledging to expand its research workforce and develop it into a global R&D hub, while emphasizing advanced packaging's importance for AI processor chips.
Key facts:
- The lab was established in 2023 and officially opened in September; Samsung is investing ¥40 billion ($254M) over five years starting 2024
- Research covers wafer bonding, glass substrates, and high-performance packaging architectures, complementing Samsung's Korean semiconductor R&D center
- Advanced packaging integrates chips like GPUs and HBM into one package to boost performance, save space, and cut costs
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