Intel EMIB packaging yield at 60-65% vs TSMC CoWoS's 98%, report says
rickasaurus · x · 2026-11-01
Taiwanese media report Intel's EMIB advanced packaging has an overall yield of 60–65%, with the silicon-bridge-into-ABF-substrate step at just 25–30% — far below TSMC's CoWoS at 98%, which remains the primary supply source.
Context: Intel fell 28.5% in a day after guiding Q4 revenue down 6% QoQ with EPS nearly halved and free cash flow concerns from higher capex. The Philadelphia semiconductor index dropped 7.2% and TSMC ADR fell 5.9%, though analysts say this isn't a signal of weakening AI demand — most CSPs' free cash flow is expected to turn positive by 2029.
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