Three papers chart advanced packaging scaling: CoWoS-R, EMIB-T, UCIe bandwidth density
jwt0625 · x · 2026-10-26
jwt0625 shares three advanced packaging papers relevant to AI accelerators: a holistic study of board-level reliability of CoWoS-R packaging on OCP accelerator modules, Intel's EMIB-T scaling roadmap for future HPC/AI demand, and a comprehensive EMIB architecture portfolio. Accompanying figures show die-to-die bandwidth density scaling from 20 to 35 Tbps/mm² as bump pitch shrinks from 55μm to 25μm, and UCIe-based EMIB reaching up to 32Gbps@45μm (UCIe-A) versus 110μm UCIe-S.
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