Diamond-Embedded Copper Vias Boost Advanced Packaging Thermal Performance

A shared study on 2.5D/3D advanced packaging embeds diamond particles in electroplated copper thermal vias, achieving an effective thermal conductivity of 514 W/mK. EDX element mapping confirms the distribution of Cu, Si, and C in the via structure.

2026-10-20 ~ 2026-10-20 · 2 related posts

• Diamond-embedded copper vias shown to boost chip thermal conductivity — jwt0625 · 2026-10-20
• Cu-Diamond Composite Thermal Vias Hit 514 W/mK for 2.5D/3D Chip Cooling — jwt0625 · 2026-10-20