Chip-equipment demand decouples from wafer volume as GAA, HBM and packaging add process steps
BenBajarin · x · 2026-10-19
- Chip-equipment demand no longer tracks wafer volume alone: GAA transistors, HBM, and advanced packaging add process steps per usable wafer.
- Cleanroom space and tool output constraints stretch capacity expansion across more years, changing the industry's demand cycle logic.
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