Engineer builds Advanced Packaging Atlas mapping 58 papers and 211 test vehicles
jwt0625 · x · 2026-10-19
jwt0625 shares a work-in-progress "Advanced Packaging Atlas" dashboard, quipping that the whole industry is "a mess." The tool aggregates 58 papers and 211 test vehicles across packaging classes (2.5D interposers, organic RDL fan-out, bridges, hybrid-bonded 3D, glass-core substrates), plotting interconnect pitch and package area over time for micro-bumps, Cu-Cu hybrid bonds, BGAs, TSVs and more, with filters by organization including IBM Research and TSMC.
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