ELSFP pain points: >3dB insertion loss, costly PMF, harsh packaging requirements
jwt0625 · x · 2026-10-16
一位光互连从业者列出 ELSFP（外置激光源可插拔封装）当前的实际痛点：
- 对光引擎的插入损耗过大，可能超过 3dB；
- 内部空间不足以容纳保偏光纤（PMF），且 PMF 本身价格昂贵；
- 封装需要洁净环境，高功率下极易烧毁器件。
这些是 CPO/外置光源方案落地中真实的工程与成本障碍。
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