Semicon West and OCP point to next bottlenecks: high-kW liquid cooling, 800VDC, semicap

BenBajarin · x · 2026-10-14

Analyst Ben Bajarin's takeaway from Semicon West and OCP: the next set of problems to solve in AI infrastructure lie deeper down the stack — higher-kW liquid cooling, 800VDC power delivery, and semiconductor capital equipment. Optical manufacturing matters too, but that was already a given.

Related event: Analysts: Next AI Infra Challenges Lie in Liquid Cooling, 800VDC and Chip Equipment(2 posts)→

Original post →

More from Infra

Infra channel →