Analysts: Next AI Infra Challenges Lie in Liquid Cooling, 800VDC and Chip Equipment

After attending Semicon West and OCP, analyst Ben Bajarin argued the next compute infrastructure challenges lie in higher-power liquid cooling, 800VDC power delivery and semiconductor equipment, adding that earlier scale-up/scale-out domain fusion could ease the per-rack 500-GPU race.

2026-10-13 ~ 2026-10-14 · 2 related posts

• OCP chatter: tighter scale-up/out compute domains could ease the race to ~500 GPUs per rack — BenBajarin · 2026-10-13
• Semicon West and OCP point to next bottlenecks: high-kW liquid cooling, 800VDC, semicap — BenBajarin · 2026-10-14