Kirin 9050 reportedly uses 1.5-micron HBI die-to-wafer packaging; analyst says scaling it is the hard part
teortaxesTex · x · 2026-10-05
- Analyst Ian Cutress cites a US packaging company: Huawei's Kirin 9050 reportedly uses 1.5-micron pitch HBI die-to-wafer bonding, while standard high-performance HBI tools already go beyond 0.75-micron pitch — "it's just a case of manufacturing at scale."
- Industry observation: wafer-to-wafer bonding scales better; die-to-wafer faces hard physical limits.
- Cutress argues "Tau Scaling" isn't new — it's a repackaging of industry practice — and warns against marketing hype: "It's about the physics."
- Quoter teortaxesTex mocks the breezy "just manufacturing at scale" framing.
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