Qualcomm licenses Huawei's LogicFolding chip tech in multiyear cross-license deal
teortaxesTex · x · 2026-10-05
- Qualcomm has agreed to a multiyear license of patents behind Huawei's new LogicFolding chipmaking technique — a rare US endorsement of Huawei's homegrown capabilities.
- The deal is part of a broader cross-license agreement covering 5G, AI services, and co-packaged optics, and still needs US FTC antitrust review.
- LogicFolding boosts data transmission speeds, working around China's lack of access to ASML's EUV machines and helping Huawei close the gap with TSMC and push into overseas AI markets despite export curbs.
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