China's Biwin bets $672M on advanced packaging to climb the storage value chain
pstAsiatech · x · 2026-09-24
Chinese storage makers are moving up the value chain from chip packaging into wafer-level operations. Shanghai-listed Biwin Storage Technology will invest 4.5 billion yuan (US$672 million) in phase three of its advanced packaging and testing project in Dongguan, exceeding the 3.09 billion yuan of the first two phases combined.
The project is still in customer sampling, process verification and small-batch production with no mass-production revenue yet. Biwin expects monthly capacity to more than triple to 10,000 wafers by end-2027, adding to its traditional memory and SiP packaging base in Huizhou.
More from Infra
- Alibaba's Banma ships AutoOmni 2.0: 3B-active edge model nears 10x-larger cloud models — 机器之心 · 2026-09-24
- Huang and Musk: China reaches advanced lithography in 2-3 years; chip bans only buy time — beffjezos · 2026-09-24
- MacBook Pro M5 Max runs AMD Radeon AI PRO R9700 over Thunderbolt 5 for local LLMs — TheOriginalG2 · 2026-09-24
- A real-time voice agent with zero US servers: Gladia STT, Gemma 4 on Scaleway, KugelAudio TTS — tobowers · 2026-09-24
- Running MiniCPM5-2B as a local agent on M4 16GB: trimming, tool-call adapter and benchmarks — 面壁智能 · 2026-09-24
- WSJ: The AI build-out is becoming the biggest economic bet in U.S. history — GeneReddit123 · 2026-09-24