Intel Foundry said to win HBM base die orders from both SK Hynix and Micron, targeted around 2029
zephyr_z9 · x · 2026-09-15
A new claim suggests Intel Foundry projects are advancing, with Terafab cooperation in place and both major HBM suppliers — SK Hynix and Micron — expected to have their base dies fabricated at Intel, with 2029 as the likely timeframe for the two suppliers. If accurate, this marks a notable win for Intel in advanced packaging and HBM integration.
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