Reading up on terahertz pulse reflectometry for inspecting CoWoS packaging layers
jwt0625 · x · 2026-09-13
The author shares a funny post showing the different layers of TSMC's CoWoS advanced packaging, and mentions reading about terahertz pulse reflectometry — a non-destructive technique for inspecting layer-by-layer structures inside advanced packages. A niche observation on the compute supply chain and advanced packaging inspection.
Related event: Terahertz Pulse Reflectometry Pins Down CoWoS Packaging Failures(2 posts)→
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