China's CXMT plans four new DRAM fabs by H2 2028, closing in on Samsung and SK hynix
zephyr_z9 · x · 2026-09-11
China's largest DRAM maker CXMT has begun equipment bidding for a new Shanghai fab, planned in two phases with capacity well above 100,000 wafers per month for that site alone. It then plans a Hefei fab in H1 2026, a Beijing fab as early as H2 2026, and another Hefei-area fab in H1 2028—four new fabs by H2 2028, rapidly narrowing the capacity gap with Samsung and SK hynix.
Related event: CXMT to Add Four DRAM Fabs by H2 2028 in Aggressive Expansion(2 posts)→
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