TSMC to start High-NA EUV production in 2030 as ASML gains broader supply roadmap
BenBajarin · x · 2026-09-09
Creative Strategies analyst Ben Bajarin published a research note arguing High-NA EUV now has a broader production roadmap: TSMC commits to High-NA EUV production starting 2030, Samsung targets 2028 for DRAM, and Intel already uses it on select layers. The technology will span advanced logic and memory, with ASML holding the clearest direct exposure—though equipment purchases depend on how many layers move to High-NA and per-tool throughput.
Related event: High-NA EUV roadmap firms up as Intel leads, TSMC and Samsung commit(2 posts)→
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