Samsung Details Custom HBM Base Die Advantages: 7 Key Benefits of Leading Edge Nodes

BenBajarin · x · 2026-08-24

Samsung's talk on custom HBM highlights the advantages of building the base die on leading edge nodes:

Higher Parallelism: Smaller TSV PHY blocks enable more parallel TSVs.
Area Savings: Smaller D2D PHY reduces silicon footprint on both base die and XPU, freeing up space for other functions.
Controller Integration: The memory controller, typically on the XPU, can be integrated into the base die.
Advanced RAS: Integration of thermal, voltage, process, and aging sensors enables real-time, high-speed telemetry. SRAM on the advanced base die handles repair and correction.
Embedded Compute: The custom die incorporates more processing elements, bringing compute capabilities to the base die.
Memory Extension: Extra space allows for memory extension controllers, enabling future expansions like HBF.
(Truncated in original post).

More from Infra