Samsung Details Custom HBM Base Die Advantages: 7 Key Benefits of Leading Edge Nodes
BenBajarin · x · 2026-08-24
Samsung's talk on custom HBM highlights the advantages of building the base die on leading edge nodes:
- Higher Parallelism: Smaller TSV PHY blocks enable more parallel TSVs.
- Area Savings: Smaller D2D PHY reduces silicon footprint on both base die and XPU, freeing up space for other functions.
- Controller Integration: The memory controller, typically on the XPU, can be integrated into the base die.
- Advanced RAS: Integration of thermal, voltage, process, and aging sensors enables real-time, high-speed telemetry. SRAM on the advanced base die handles repair and correction.
- Embedded Compute: The custom die incorporates more processing elements, bringing compute capabilities to the base die.
- Memory Extension: Extra space allows for memory extension controllers, enabling future expansions like HBF.
- (Truncated in original post).
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