TSMC's 5.5x Reticle CoWoS Hits >98% Yield, 14x Version Coming by 2029
zephyr_z9 · x · 2026-08-11
TSMC's head of advanced packaging, Jun He, revealed that 5.5x reticle size CoWoS is now in mass production for multiple AI clients with over 98% yields. A larger 14x reticle size version is expected by 2029.
TSMC currently operates 10 advanced packaging plants and has doubled CoWoS capacity annually over the last three years. For 3D stacking, the 6-micron hybrid bonding pitch for SoIC entered mass production last year and will shrink to 4.5 microns by 2029 to support A14 chip stacking.
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