Chinese etch-tool maker says 90:1 low-temperature tool is now in customer validation

zephyr_z9 · x · 2026-07-26

• A Chinese equipment vendor is claiming rapid progress in dielectric etch tools, including a 90:1 ultra-high aspect ratio low-temperature etcher now delivered for customer validation.
• The post argues that, except for DUV lithography (and possibly HARC etch), China has essentially localized most semiconductor equipment.
• The attached image repeats the company claim that the new 90:1 tool has been delivered and that its lineup now covers ultra-high aspect-ratio memory etch needs.

Original post →

More from Infra

• How infrastructure teams are using MCP-connected AI agents as copilot layers — BestRequirement7539 · 2026-07-26
• A OnePlus 12 can run Z Image Turbo and Flux.2 locally, but a 320×320 image still takes minutes — sgcego · 2026-07-26
• Founder Reveals Why They Stopped Fundraising: Compute Bottlenecks Outweigh Capital Needs — bookwormengr · 2026-07-26
• RTK is a Rust CLI proxy that cuts AI agent shell output by up to 90% — OpenAIDevs · 2026-07-26
• Inference providers may need cache policies that respect tool-call timeout settings — lucasmeijer · 2026-07-26
• OpenSmith adds local LLM tracing, live dashboards, and OpenTelemetry export — Maleficent-Emu-4549 · 2026-07-26

Infra channel →