Advanced Substrates Become the Bottleneck for CoWoS Capacity
tengyanAI · x · 2026-07-20
As AI chip package sizes increase and integrate more HBM, demands on substrate dimensional accuracy and warpage control have skyrocketed. Advanced substrate quality is now the core factor limiting CoWoS yields.
Since expanding advanced substrate capacity takes years, the supply chain cannot quickly respond to surging AI demands. This gives TSMC and key substrate suppliers (like Kinsus) tremendous power over capacity allocation and pricing.
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