AI Infrastructure and Semiconductor Industry Briefs
创业邦 · wechat · 2026-07-16
A roundup of industry news focused on AI infrastructure and the semiconductor supply chain:
- 三星电子/三星显示: Jointly developing next-generation glass interposers, aiming to produce prototypes soon to bid for major global clients.
- SK 海力士 Capacity: Bank of America notes that due to tech upgrades and old fab closures, new memory capacity additions by 2028 might be only a sixth of the original plan.
- LG 新能源 × 谷歌: LG Energy Solution will supply batteries for Google's largest solar-plus-storage project, initially featuring 1.6GW of solar and roughly 2GWh of storage, with further expansion planned. This highlights how AI data center power demand is driving energy infrastructure.
- 阿斯麦 × 英特尔: ASML stated that Intel has started using its latest High-NA EUV lithography machines for chip production, a key signal of broader adoption for the new equipment.
The brief also mentions Apple raising targets for its foldable phones, China-Thailand collaboration on trapped-ion quantum computers, and commercial rocket launches, but the main focus remains on chips, capacity, and data center hardware/infrastructure.
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