DRAM Capacity and Lithography Bottlenecks
teortaxesTex · x · 2026-07-14
The shared content notes that CXMT is building its DRAM fab in half the time of its competitors, claiming it takes only about 12 months to complete. Currently, the only obvious capacity bottleneck is lithography equipment. The author adds that the next thing to watch is what equipment ASML will supply to them. The cited article focuses on "how to break the memory supercycle," mentioning that the SK Group Chairman stated client demand for supply is 4x-5x, yet wafer supply may only grow by 2x by 2030.
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